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IBM today announced an innovative chip design that can improve performance fourfold or reduce power consumption fivefold in wireless devices compared to the state-of-the-art thin-silicon bipolar technology. To improve the reliability of wireless devices, chip manufacturers have created SiGe BiCMOS chips that put computing and communications transistors onto one chip instead of using separate chips...

The post IBM New Chip Design appeared first on VR-Zone.

IBM New Chip Design

IBM today announced an innovative chip design that can improve performance fourfold or reduce power consumption fivefold in wireless devices compared to the state-of-the-art thin-silicon bipolar technology. To improve the reliability of wireless devices, chip manufacturers have created SiGe BiCMOS chips that put computing and communications transistors onto one chip instead of using separate chips...

The post IBM New Chip Design appeared first on VR-Zone.