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In the last few months, TSMC has battled reliability issues in the back end of the line because of differences in the way low-k materials expand during thermal stress, some clients’ chips failed high-temperature tests. Low-k dielectrics deliver about a 10 percent performance improvement over fluorinated silicate glass, the more prevalent insulator. Toward the middle...

The post TSMC Reworking Low-K Process appeared first on VR-Zone.

TSMC Reworking Low-K Process

In the last few months, TSMC has battled reliability issues in the back end of the line because of differences in the way low-k materials expand during thermal stress, some clients’ chips failed high-temperature tests. Low-k dielectrics deliver about a 10 percent performance improvement over fluorinated silicate glass, the more prevalent insulator. Toward the middle...

The post TSMC Reworking Low-K Process appeared first on VR-Zone.