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IBM researchers unveiled details of a new technique to significantly increase capabilities to cool computer chips. The technique, developed by a team of scientists at the IBM Zurich Research Laboratory in cooperation with Momentive Performance Materials, formerly GE Advanced Materials, overcomes a barrier in chip cooling by improving the application of the “glue” that binds...

The post IBM Unveils Super Conductive Thermal Paste appeared first on VR-Zone.

IBM Unveils Super Conductive Thermal Paste

IBM researchers unveiled details of a new technique to significantly increase capabilities to cool computer chips. The technique, developed by a team of scientists at the IBM Zurich Research Laboratory in cooperation with Momentive Performance Materials, formerly GE Advanced Materials, overcomes a barrier in chip cooling by improving the application of the “glue” that binds...

The post IBM Unveils Super Conductive Thermal Paste appeared first on VR-Zone.