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Samsung has developed the first all-DRAM stacked memory package using ‘through silicon via’ (TSV) technology, which will soon result in memory packages that are faster, smaller and consume less power. The new wafer-level-processed stacked package (WSP) consists of four 512Mb DDR2 DRAM chips that offer a combined 2Gb of high density memory. Using the TSV-processed...

The post Samsung 4GB DDR2 DIMMs On Stacked Process appeared first on VR-Zone.

Samsung 4GB DDR2 DIMMs On Stacked Process


Samsung has developed the first all-DRAM stacked memory package using ‘through silicon via’ (TSV) technology, which will soon result in memory packages that are faster, smaller and consume less power. The new wafer-level-processed stacked package (WSP) consists of four 512Mb DDR2 DRAM chips that offer a combined 2Gb of high density memory. Using the TSV-processed...

The post Samsung 4GB DDR2 DIMMs On Stacked Process appeared first on VR-Zone.