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0.13 micron at TSMC or IBM 205-210 million of transistors High Speed Interconnect (HSI) – AGP8x Protocol w/ PCI Express Bridge 500-600MHz Core Clock GDDR1/2/3 Memory controller 600-800Mhz Memory Clock 16 full rendering pipelines Pixel and Vertex Shaders 3.0 DirectX 9.0 and OpenGL support Launch delayed to April   Q1 2004 Q2 2004 High End...

The post NV40 Specifications Confirmed appeared first on VR-Zone.

NV40 Specifications Confirmed

0.13 micron at TSMC or IBM 205-210 million of transistors High Speed Interconnect (HSI) – AGP8x Protocol w/ PCI Express Bridge 500-600MHz Core Clock GDDR1/2/3 Memory controller 600-800Mhz Memory Clock 16 full rendering pipelines Pixel and Vertex Shaders 3.0 DirectX 9.0 and OpenGL support Launch delayed to April   Q1 2004 Q2 2004 High End...

The post NV40 Specifications Confirmed appeared first on VR-Zone.