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Samsung just announced a new method to pack more memory into small spaces — three-dimensional chip packaging. The technique works by adding “through silicon” interconnects on the memory module and then daisy chaining multiple modules through the interconnects. Samsung has dubbed this new technology “wafer-level stack process” or WSP. Image from DailyTech Existing semiconductor packaging...

The post Samsung Announces 3D Chip Packaging Technology appeared first on VR-Zone.

Samsung Announces 3D Chip Packaging Technology


Samsung just announced a new method to pack more memory into small spaces — three-dimensional chip packaging. The technique works by adding “through silicon” interconnects on the memory module and then daisy chaining multiple modules through the interconnects. Samsung has dubbed this new technology “wafer-level stack process” or WSP. Image from DailyTech Existing semiconductor packaging...

The post Samsung Announces 3D Chip Packaging Technology appeared first on VR-Zone.