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IBM researchers presented an innovative approach for improving the cooling of computer chips, an increasingly urgent need given the large amount of heat released by today’s more powerful processors and the additional energy required for removing that heat. The technique, called "high thermal conductivity interface technology," allows a twofold improvement in heat removal over current...

The post IBM Next-Gen Chip-Cooling Technologies appeared first on VR-Zone.

IBM Next-Gen Chip-Cooling Technologies


IBM researchers presented an innovative approach for improving the cooling of computer chips, an increasingly urgent need given the large amount of heat released by today’s more powerful processors and the additional energy required for removing that heat. The technique, called "high thermal conductivity interface technology," allows a twofold improvement in heat removal over current...

The post IBM Next-Gen Chip-Cooling Technologies appeared first on VR-Zone.