Layout Mode
Header Styles
Header 1 Header 2
Colors
line wechat cachevrzone
whatsapp (+65) 8581 8999
email cachecs@vr-zone.com

IBM and AMD presented papers describing the use of immersion lithography, ultra-low-K interconnect dielectrics, and multiple enhanced transistor strain techniques for application to the 45nm microprocessor process generation. AMD and IBM expect the first 45nm products using immersion lithography and ultra-low-K interconnect dielectrics to be available in mid-2008. The continued enhancement of AMD and IBM’s...

The post AMD & IBM Upbeat On 45nm CPUs appeared first on VR-Zone.

AMD & IBM Upbeat On 45nm CPUs

IBM and AMD presented papers describing the use of immersion lithography, ultra-low-K interconnect dielectrics, and multiple enhanced transistor strain techniques for application to the 45nm microprocessor process generation. AMD and IBM expect the first 45nm products using immersion lithography and ultra-low-K interconnect dielectrics to be available in mid-2008. The continued enhancement of AMD and IBM’s...

The post AMD & IBM Upbeat On 45nm CPUs appeared first on VR-Zone.