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TSMC would complete 45nm technology qualification and enter production as early as September 2007. The new 45nm process combines the most advanced 193nm immersion photolithography, competitive performance-enhancing silicon strains, and extreme low-k (ELK) inter-metal dielectric material. TSMC’s 45nm low power process (LP) provides twice the density of 65nm with significantly lower power and manufacturing cost...

The post TSMC To Enter 45nm Production In Sep appeared first on VR-Zone.

TSMC To Enter 45nm Production In Sep

TSMC would complete 45nm technology qualification and enter production as early as September 2007. The new 45nm process combines the most advanced 193nm immersion photolithography, competitive performance-enhancing silicon strains, and extreme low-k (ELK) inter-metal dielectric material. TSMC’s 45nm low power process (LP) provides twice the density of 65nm with significantly lower power and manufacturing cost...

The post TSMC To Enter 45nm Production In Sep appeared first on VR-Zone.