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IBM has found a way to connect chips inside products ranging from cell phones to supercomputers, an advance that promises to prolong battery life in wireless devices and eventually speed data transfers between the processor and memory chips in computers. In IBM’s solution, two chips are sandwiched on top of one another and held together...

The post IBM To Stack Chips For Faster Data Transfer appeared first on VR-Zone.

IBM To Stack Chips For Faster Data Transfer

IBM has found a way to connect chips inside products ranging from cell phones to supercomputers, an advance that promises to prolong battery life in wireless devices and eventually speed data transfers between the processor and memory chips in computers. In IBM’s solution, two chips are sandwiched on top of one another and held together...

The post IBM To Stack Chips For Faster Data Transfer appeared first on VR-Zone.